• DocumentCode
    3033741
  • Title

    Multi-echelon network optimization of pharmaceutical cold chains: A simulation study

  • Author

    Kulkarni, Niranjan S. ; Niranjan, Suman

  • Author_Institution
    CRB Consulting Eng., Cambridge, MA, USA
  • fYear
    2013
  • fDate
    8-11 Dec. 2013
  • Firstpage
    3486
  • Lastpage
    3498
  • Abstract
    To ensure quality of pharmaceutical raw materials and products it is very important to monitor specific factors throughout supply chain. In cold chains, temperature is closely controlled and monitored. Furthermore, it is critical to retain all associated information artifacts from a reporting, inspection and auditing standpoint. Loss in information can translate to significant monitory losses to parties involved. Consequently, cost not only includes all traditional supply chain costs, but also contains costs associated with penalties due to information loss/inaccuracy. Therefore, managing pharmaceutical cold chain costs is more challenging than managing traditional supply chain costs. This paper studies a typical cold chain and costs associated with a typical multi-echelon network under stochastic demand and probabilistic information handoff conditions. Dynamic equations are developed for individual nodes. A DOE is also proposed to understand sensitivity of key factors on costs. A simulation based optimization approach is adopted for the study.
  • Keywords
    condition monitoring; costing; design of experiments; industrial economics; inspection; optimisation; pharmaceutical industry; product quality; supply chain management; DOE; auditing; dynamic equations; information inaccuracy; information loss; inspection; multiechelon network optimization; penalties; pharmaceutical cold chain cost management; pharmaceutical raw materials quality; probabilistic information; product quality; reporting; stochastic demand; supply chain costs; temperature control; temperature monitoring; Monitoring; Pharmaceuticals; Supply chains; Temperature control; Temperature distribution; Temperature measurement; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation Conference (WSC), 2013 Winter
  • Conference_Location
    Washington, DC
  • Print_ISBN
    978-1-4799-2077-8
  • Type

    conf

  • DOI
    10.1109/WSC.2013.6721711
  • Filename
    6721711