DocumentCode :
3034335
Title :
Use of electronic module descriptions for modular and Reconfigurable Assembly Systems
Author :
Siltala, Niko ; Tuokko, Reijo
Author_Institution :
Dept. of Production Eng., Tampere Univ. of Technol., Tampere, Finland
fYear :
2009
fDate :
17-20 Nov. 2009
Firstpage :
214
Lastpage :
219
Abstract :
The paper presents how a newly developed emplacement concept can be utilised for designing, deployment and execution of modular evolvable or reconfigurable assembly systems. The emplacement concept specifies the assembly modules in electronic description formats (XML based), which consists at the moment emplacement and blue print file formats. The former is used for abstract level specifications and for harmonisation of modules. These files are specified by a user group. The latter is the virtual representation of the module itself provided by the module vendor. The module interfaces (preferably basing on international interface standards), processing/manufacturing capabilities (i.e. skills) and standardised processes play important role in the concept. This paper focuses on the use of the concept and how the different interest groups can take advantage of the proposed concept. Also some use cases and tools supporting the concept are presented.
Keywords :
manufacturing systems; production engineering computing; virtual manufacturing; blue print file formats; electronic description formats; electronic module descriptions; emplacement concept; module vendor; reconfigurable assembly systems; virtual representation; Assembly systems; Costs; Data handling; Design automation; Manufacturing automation; Manufacturing processes; Production engineering; Production systems; System analysis and design; XML; Assembly systems; Blue Print; Design automation; Electronic Module Description; Electronic data interchange; Emplacement; Manufacturing automation; System analysis and design;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Assembly and Manufacturing, 2009. ISAM 2009. IEEE International Symposium on
Conference_Location :
Suwon
Print_ISBN :
978-1-4244-4627-8
Electronic_ISBN :
978-1-4244-4628-5
Type :
conf
DOI :
10.1109/ISAM.2009.5376903
Filename :
5376903
Link To Document :
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