• DocumentCode
    3034374
  • Title

    Fab simulation with recipe arrangement of tools

  • Author

    Park, Sang C. ; Euikoog Ahn ; Yongho Chung ; Ka-ram Yang ; Kim, Byung H. ; Seo, Jeong C.

  • Author_Institution
    Dept. of IE, Ajou Univ., Suwon, South Korea
  • fYear
    2013
  • fDate
    8-11 Dec. 2013
  • Firstpage
    3840
  • Lastpage
    3849
  • Abstract
    Presented in this paper is a FAB simulation framework considering the recipe arrangement problem of FAB tools. It is known that the WIP fluctuation is mainly caused by improper dispatching rules. Practical point of view, however, there is another cause of the WIP imbalance. We call the problem as a “recipe arrange problem of tools”. A FAB consists of multiple tool groups, and each tool group has multiple tools (machine devices). Currently, FAB tools belonging to the same tool group are assumed to perform the same set of recipes (operations). Practically, however, this is not true. Since FAB tools are extremely sensitive, tools even belonging to the same tool group are assigned different recipes with high yield. We developed a simulation model including the recipe arrangement problem by modifying MIMAC6, and conducted simulation with SEEPLAN® developed by the VMS solutions. The simulation result shows that it is necessary to have not only dispatching rules, but also arranging rules are required to minimize the WIP fluctuations in a FAB.
  • Keywords
    digital simulation; manufacturing systems; production engineering computing; semiconductor device manufacture; work in progress; FAB simulation framework; FAB tools; MIMAC6; SEEPLAN simulation; VMS solutions; WIP fluctuation; WIP imbalance; dispatching rules; machine devices; recipe arrangement problem; recipe-arrange-problem-of-tools problem; tool groups; work-in-process; Dispatching; Fluctuations; Job shop scheduling; Load modeling; Performance evaluation; Semiconductor device modeling; Simulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation Conference (WSC), 2013 Winter
  • Conference_Location
    Washington, DC
  • Print_ISBN
    978-1-4799-2077-8
  • Type

    conf

  • DOI
    10.1109/WSC.2013.6721743
  • Filename
    6721743