• DocumentCode
    3034432
  • Title

    Environmental effects on droplet self-alignment assisted hybrid microassembly

  • Author

    Jääskeläinen, Mirva ; Sariola, Veikko ; Zhou, Quan

  • Author_Institution
    Dept. of Autom. & Syst. Technol., Helsinki Univ. of Technol., Espoo, Finland
  • fYear
    2009
  • fDate
    17-20 Nov. 2009
  • Firstpage
    177
  • Lastpage
    182
  • Abstract
    This paper reports an experimental study of environmental effects on a hybrid microhandling technique that combines robotic microhandling and droplet based self-alignment. The effects of relative humidity on reliability and on duration of the hybrid microassembly are studied in two cases. The first one is with 300 ¿m × 300 ¿m × 70 ¿m SU-8 parts on the top of another part of the same material and size. The second one is with silicon parts of about 700 ¿m × 700 ¿m × 150 ¿m on hydrophilic patterns. A custom-made microrobotic platform, an environment control system and a high speed camera are used in the study. The study shows that the humidity of the ambient environment has a certain effect on the performance of the hybrid handling strategy. It seems that higher humidity is beneficial to the handling. The results also show that the reliability was lower in low humidities with a small amount of water and the duration was longer in low humidities in certain tests.
  • Keywords
    environmental factors; humidity; materials handling equipment; microassembling; micromanipulators; custom-made microrobotic platform; droplet self-alignment assisted hybrid microassembly; environment control system; environmental effects; high speed camera; humidity; hybrid handling strategy; hybrid microassembly; hybrid microhandling technique; relative humidity; reliability; robotic microhandling; Adhesives; Grippers; Humidity; Manufacturing automation; Microassembly; Pulp manufacturing; Robotic assembly; Robots; Self-assembly; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Assembly and Manufacturing, 2009. ISAM 2009. IEEE International Symposium on
  • Conference_Location
    Suwon
  • Print_ISBN
    978-1-4244-4627-8
  • Electronic_ISBN
    978-1-4244-4628-5
  • Type

    conf

  • DOI
    10.1109/ISAM.2009.5376909
  • Filename
    5376909