• DocumentCode
    3034518
  • Title

    Laser sintering of the printed silver ink

  • Author

    Kim, Myong-Ki ; Hwang, Jun Young ; Kang, Heuiseok ; Kang, Kyungtae ; Lee, Sang-Ho ; Moon, Seung-Jae

  • Author_Institution
    Fusion Technol. R&D Div., Korea Inst. of Ind. Technol., Ansan, South Korea
  • fYear
    2009
  • fDate
    17-20 Nov. 2009
  • Firstpage
    155
  • Lastpage
    158
  • Abstract
    Because flexible electronics have a weak characteristic in high temperature, the conductive ink including nano-metal particles is printed on flexible substrate by printing methods such as screen printing, inkjet printing, and R2R. Due to high electrical resistance of printed metal ink, the process to improve the property of electrical conductivity is needed. To improve the conductivity, the furnace curing is used after printing the ink on the substrate. But this process spends much time for curing. Therefore, flexible substrate or glass substrate can be damaged due to long exposed time. The curing by using a laser is utilized to minimize the damage of flexible substrate. In this work, the specific resistance of silver ink by using furnace curing at the temperature of 250°C after 30 minutes is 3 × 10-8 ¿m. The specific resistance of silver ink by the laser curing at the power of 5 W from 5 sec to 10 sec is 2. 38 × 10-8 ¿m. Consequently, the curing time by using the laser is significantly smaller than that of the furnace curing.
  • Keywords
    curing; flexible electronics; furnaces; ink; ink jet printing; laser sintering; R2R; conductive ink; electrical conductivity; flexible electronics; flexible substrate; furnace curing; inkjet printing; laser curing; laser sintering; nanometal particles; power 5 W; printed metal ink; screen printing; silver ink; temperature 250 C; time 30 min; time 5 s to 10 s; Conductivity; Curing; Electric resistance; Flexible electronics; Furnaces; Ink; Laser sintering; Printing; Silver; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Assembly and Manufacturing, 2009. ISAM 2009. IEEE International Symposium on
  • Conference_Location
    Suwon
  • Print_ISBN
    978-1-4244-4627-8
  • Electronic_ISBN
    978-1-4244-4628-5
  • Type

    conf

  • DOI
    10.1109/ISAM.2009.5376912
  • Filename
    5376912