Title :
A robotics package assembly system
Author :
Andrews, James ; Settles, John ; Wang, James
Author_Institution :
Adv. Interconnect Syst. Lab., Motorola SPS Inc., Tempe, AZ, USA
Abstract :
A robotics packaging assembly system for use in demonstrating the manufacturability of new RF module designs in a package development environment is described. The programmable line accommodates a variety of flip chip technologies, substrate materials and process conditions by means of stored program retrieval and execution. System requirements are discussed along with principles used in package design for assembly in a machine vision environment. Flip chip technology is one of the central design elements used to obtain automated assembly of low cost, small outline packages with stable RF performance. System performance is given for the assembly of flip chip Si and GaAs devices
Keywords :
assembling; flexible manufacturing systems; flip-chip devices; industrial robots; integrated circuit packaging; robot vision; RF module designs; RF package assembly; automated assembly; flip chip technologies; machine vision; manufacturability; package development environment; packaging assembly system; process conditions; programmable line; robotics assembly line; small outline packages; stored program retrieval; Assembly systems; Costs; Flip chip; Gallium arsenide; Machine vision; Manufacturing; Packaging machines; Radio frequency; Robotic assembly; System performance;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1994. Low-Cost Manufacturing Technologies for Tomorrow's Global Economy. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International
Conference_Location :
La Jolla, CA
Print_ISBN :
0-7803-2037-9
DOI :
10.1109/IEMT.1994.404672
