Title :
Thermosonic flip chip bonding using lateral vibration with anisotropic conductive film (ACF)
Author :
Jang, Tae-Young ; Ha, Chang-Wan ; Kim, Kyung-soo
Author_Institution :
Dept. of Mech. Eng., KAIST, Daejeon, South Korea
Abstract :
In this paper, a new aspect of thermosonic (TS) bonding with anisotropic conductive film (ACF) is presented to take into account the fast curing of ACF. For quick bonding process with ACF, the lateral ultrasonic vibration is applied in parallel to thermocompression (TC) process. The feasibility of TS bonding is demonstrated by experiments for chip-on-glass (COG) bonding. To understand the curing characteristics of the adopted ACF, the measurements with differential scanning calorimeter (DSC) are performed. Moreover, the in-situ temperatures of ACF during TC and TS bonding are measured to show the effect of additional heat generation by lateral ultrasonic vibration.
Keywords :
curing; differential scanning calorimetry; films; flip-chip devices; lead bonding; tape automated bonding; vibrations; DSC; anisotropic conductive film; chip-on-glass bonding; curing; differential scanning calorimeter; heat generation; lateral ultrasonic vibration; thermocompression process; thermosonic flip chip bonding; Anisotropic conductive films; Assembly; Bonding; Chip scale packaging; Curing; Flip chip; Semiconductor device measurement; Temperature; Ultrasonic variables measurement; Vibrations; Anisotropic conductive film; flip chip bonding; thermosonic bonding;
Conference_Titel :
Assembly and Manufacturing, 2009. ISAM 2009. IEEE International Symposium on
Conference_Location :
Suwon
Print_ISBN :
978-1-4244-4627-8
Electronic_ISBN :
978-1-4244-4628-5
DOI :
10.1109/ISAM.2009.5376921
