DocumentCode
3034748
Title
Ceramics packaging with ferroelectric decoupling capacitor
Author
Tummala, Rao R. ; Eggerding, Carl L.
Author_Institution
IBM Corp., Hopewell Junction, NY, USA
fYear
1990
fDate
6-8 Jun 1990
Firstpage
28
Lastpage
30
Abstract
Packaging is the most important application of ceramics in microelectronics. The continued evolution of ceramics and the processes with which the most advanced substrates will be fabricated are summarized. A discrete ferroelectric decoupling capacitor providing very low inductance to minimize the delta-I noise of ceramic packages is described
Keywords
capacitors; ceramics; ferroelectric devices; ferroelectric materials; packaging; substrates; ceramics; delta-I noise; ferroelectric decoupling capacitor; microelectronics; packaging; substrates; Capacitors; Ceramics; Circuits; Conducting materials; Ferroelectric materials; Inductance; Semiconductor device packaging; Substrates; Thermal conductivity; Thermal expansion;
fLanguage
English
Publisher
ieee
Conference_Titel
Applications of Ferroelectrics, 1990., IEEE 7th International Symposium on
Conference_Location
Urbana-Champaign, IL
Print_ISBN
0-7803-0190-0
Type
conf
DOI
10.1109/ISAF.1990.200193
Filename
200193
Link To Document