Design and fabrication of 600 DPI light-emitting diode printheads using precision flip-chip solder bump technology

Author

Imler, William R. ; Hildebrandt, Terry ; Paolini, Steve ; Scholz, Kenneth D. ; Cobarruviaz, Maria ; Nagesh, V.K.

Author_Institution

Hewlett-Packard Co., Palo Alto, CA, USA

fYear

1994

fDate

12-14 Sep 1994

Firstpage

154

Abstract

We have described the design and fabrication of a 600 DPI LED printhead using solder bumped flip chip assembly technology. This combination of high performance and low manufacturing cost would have been difficult or impossible to achieve with wire bonding. The benefits of flip chip assembly technology over conventional wire bonding techniques also include reduced LED and IC wafer area for equivalent function, improved reliability, greatly reduced product size and weight, and the ability to easily rework the printhead if necessary

Keywords

LED printers; electrophotography; flip-chip devices; integrated circuit design; integrated circuit packaging; light emitting diodes; printers; semiconductor device reliability; soldering; IC wafer area; LED area; flip-chip solder bump technology; light-emitting diode printheads; manufacturing cost; product size; product weight; reliability; Assembly; Costs; Fabrication; Flip chip; Gallium arsenide; Light emitting diodes; Manufacturing; Printers; Printing; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1994. Low-Cost Manufacturing Technologies for Tomorrow's Global Economy. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International

Conference_Location

La Jolla, CA

Print_ISBN

0-7803-2037-9

Type

conf

DOI

10.1109/IEMT.1994.404674

Filename

404674