Title :
Low cost solder bumped flip chip MCM-L demonstration
Author :
Kelly, Mike ; Lau, John
Author_Institution :
Hewlett-Packard Co., USA
Abstract :
A low cost multichip module employing solder bumped flip chips mounted on an organic substrate was demonstrated. This functional prototype was used to help assess the preliminary feasibility of low temperature solder bumped flip chip applications, from wafer design, sourcing, and bumping, substrate design and fabrication, to MCM-L assembly
Keywords :
assembling; flip-chip devices; integrated circuit packaging; multichip modules; soldering; MCM-L; assembly; bumping; functional prototype; low cost multichip module; organic substrate; solder bumped flip chips; sourcing; substrate design; wafer design; Application specific integrated circuits; Costs; Flip chip; Integrated circuit technology; Read only memory; Surface-mount technology; Temperature; Vehicles; Wafer bonding; Wire;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1994. Low-Cost Manufacturing Technologies for Tomorrow's Global Economy. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International
Conference_Location :
La Jolla, CA
Print_ISBN :
0-7803-2037-9
DOI :
10.1109/IEMT.1994.404675
