Title :
An improved full wave analysis for open circular microstrip structures
Author :
Wen Xun Zhang ; Guo Zhong Jiang
Author_Institution :
State Key Lab., Southeast Univ., Nanjing, China
Abstract :
The circular microstrip patch has been analyzed by various methods. The cavity mode theory is valid only when the thickness of the substrate is relatively thin compared to the operating wavelength. The ordinary full-wave analysis may be employed for a thick substrate, but as the Green´s function is directly derived from boundary conditions by a complicated process, it will be more troublesome for multilayered substrates or patches. The improved full-wave method presented, which is based on the vector Hankel transform and the spectral domain immitance matrix approach, has the following attractive features: (1) the Green´s functions in the spectral domain can be derived by using the equivalent transmission line method; (2) only single integration are required; (3) only low-order matrix is dealt with; and (4) the inverse vector Hankel transform is not needed. Several numerical examples are compared with available experimental data.
Keywords :
Green´s function methods; Hankel transforms; antenna radiation patterns; electric immittance; matrix algebra; microstrip antennas; spectral-domain analysis; Green´s function; boundary conditions; cavity mode theory; circular microstrip patch; equivalent transmission line method; experimental data; improved full wave analysis; integration; low order matrix; multilayered patches; multilayered substrates; open circular microstrip structures; spectral domain immitance matrix; vector Hankel transform; Boundary conditions; Electromagnetic analysis; Electromagnetic fields; Green´s function methods; Integral equations; Magnetic analysis; Microstrip; Tellurium; Transmission line matrix methods; Transmission line theory;
Conference_Titel :
Antennas and Propagation Society International Symposium, 1996. AP-S. Digest
Conference_Location :
Baltimore, MD, USA
Print_ISBN :
0-7803-3216-4
DOI :
10.1109/APS.1996.549625