DocumentCode
3035731
Title
Design and procurement of eutectic Sn/Pb solder-bumped flip chip test die and organic substrates
Author
Lau, John ; Heydinger, Matt ; Glazer, Judy ; Uno, Dan
Author_Institution
Hewlett-Packard Co., Palo Alto, CA, USA
fYear
1994
fDate
12-14 Sep 1994
Firstpage
132
Abstract
A case study was conducted to investigate the issues associated with the design and procurement of flip chip test die and corresponding organic substrates. Test wafers were fabricated by an IC supplier and bumped with electroplated eutectic Sn/Pb by a third party. Issues associated with transferring integrated circuit data to printed circuit design software were identified. The bare and bumped wafers were characterized to identify possible criteria for lot qualification
Keywords
electroplating; flip-chip devices; integrated circuit packaging; lead alloys; printed circuits; soldering; tin alloys; SnPb; bumped wafers; electroplated eutectic solder; lot qualification; organic substrates; solder-bumped flip chip test die; Assembly; Circuit testing; Flip chip; Integrated circuit technology; Integrated circuit testing; Printed circuits; Procurement; Resins; Surface-mount technology; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 1994. Low-Cost Manufacturing Technologies for Tomorrow's Global Economy. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International
Conference_Location
La Jolla, CA
Print_ISBN
0-7803-2037-9
Type
conf
DOI
10.1109/IEMT.1994.404677
Filename
404677
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