Design and packaging of small 60 GHz antenna array for multi-chip communication

Author

Ho-Hsin Yeh ; Melde, Kathleen L. ; Eisenstadt, William R.

Author_Institution

Dept. of Electr. & Comput. Eng., Univ. of Arizona, Tucson, AZ, USA

fYear

2012

fDate

11-16 Nov. 2012

Firstpage

1

Lastpage

4

Abstract

In this paper, the design of a directive two-antenna 60 GHz array for chip-to-chip communications is proposed. The small array is used to improve the wireless link budget. The antenna system is designed in a package (AiP) which could be placed on the top of a silicon substrate. The analysis of the radiated fields, the packagine integration the feeding circuits are discussed in this paper. With proper design considerations, this 60 GHz antenna system demonstrates improved horizontal transmission capability and wireless link efficiency.

Keywords

antenna arrays; packaging; antenna array design; antenna array packaging; antenna system; chip to chip communication; feeding circuits; frequency 60 GHz; horizontal transmission capability; multichip communication; silicon substrate; wireless link budget; wireless link efficiency; Antenna arrays; Antenna radiation patterns; Arrays; Silicon; Transmitting antennas; Wireless communication; antenna feeding; antenna in package (AiP); antenna radiation patterns; communication in multi-chip module;

fLanguage

English

Publisher

ieee

Conference_Titel

Wireless Information Technology and Systems (ICWITS), 2012 IEEE International Conference on

Conference_Location

Maui, HI

Print_ISBN

978-1-4673-0947-9

Type

conf

DOI

10.1109/ICWITS.2012.6417762

Filename

6417762