Title :
Table of contents
Abstract :
The following topics are dealt with: Interconnect Technology; systems and interconnects; process integration; materials and unit process; back end memory and MEMS; reliability and characterization; packaging, 3D and TSV; and novel materials and concept.
Keywords :
interconnections; memory architecture; micromechanical devices; packaging; reliability; three-dimensional integrated circuits; MEMS; TSV; back end memory; interconnect technology; novel materials; packaging; process integration; reliability; unit process;
Conference_Titel :
Interconnect Technology Conference (IITC), 2010 International
Conference_Location :
Burlingame, CA
Print_ISBN :
978-1-4244-7676-3
DOI :
10.1109/IITC.2010.5510592
