• DocumentCode
    3036714
  • Title

    Eliminating the top causes of customer-attributable integrated circuit failures

  • Author

    Olney, Andrew H.

  • Author_Institution
    Analog Devices, Inc., Wilmington, MA, USA
  • fYear
    2013
  • fDate
    15-19 July 2013
  • Firstpage
    8
  • Lastpage
    14
  • Abstract
    The failure rates of electronic systems can be minimized if Original Equipment Manufacturers (OEMs), Original Design Manufacturers (ODMs), and Contract Manufacturers (CMs) follow specific guidelines for eliminating the most common causes of customer-attributable integrated circuit (IC) failures. Most importantly, OEMs/ODMs/CMs should always buy ICs directly from Original Component Manufacturers (OCMs) or their Authorized Distributors to ensure that ICs are authentic and have full factory warranties. Appropriate electrical overstress/electrostatic discharge (EOS/ESD) protection techniques should be used at the board-level and/or system-level. For particularly high-reliability applications, IC operating voltages and currents should be maintained well below IC Absolute Maximum Ratings. Since the failure rate for many IC failure mechanisms increases exponentially with increasing temperature, electronic systems should be designed to provide adequate cooling. Finally, OCMs´ instructions for proper storage, handling, and board mounting of ICs need to always be followed, with particular attention given to moisture-sensitive components.
  • Keywords
    electrostatic discharge; failure analysis; integrated circuit design; integrated circuit reliability; integrated circuit testing; contract manufacturers; customer-attributable integrated circuit failures; electrical overstress; electronic systems; electrostatic discharge; failure rates; original component manufacturers; original design manufacturers; original equipment manufacturers; Earth Observing System; Electrostatic discharges; Failure analysis; Gold; Integrated circuits; Pins; Reliability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
  • Conference_Location
    Suzhou
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4799-1241-4
  • Type

    conf

  • DOI
    10.1109/IPFA.2013.6599118
  • Filename
    6599118