Vertical interconnects for phased array packaging

Tile architectures have been receiving significant interest for use in phased array antenna systems, particularly for higher frequency bands. This architecture involves placing the radiating elements, distribution networks, and active devices on parallel layers. The layers are separated by ground planes which provide isolation between the transmission lines and devices on different layers. advantages of this construction are reduced size, weight, and cost. Interconnections required for this array construction are layer to layer vertical transitions. This paper presents several vertical interconnect approaches suitable for use in such phased array antenna systems.