DocumentCode :
3036934
Title :
A high latchup - Immune ESD protection SCR-incorporated BJT in deep submicron technology
Author :
Chih-Yao Huang ; Fu-Chien Chiu ; Ji-Fan Chi ; Yi-Jou Huang ; Quo-Ker Chen ; Jen-Chou Tseng
Author_Institution :
Dept. of Electron. Eng., Chien Hsin Univ. of Sci. & Technol., Zhongli, Taiwan
fYear :
2013
fDate :
15-19 July 2013
Firstpage :
72
Lastpage :
77
Abstract :
An SCR-incorporated BJT for latchup and ESD optimization is developed in a 0.18μm-3.3V process. This device simply consists of a floating P+ region in a parasitic NPN BJT. Its optimized second breakdown current exceeds 80% that of an SCR and latchup triggering current is 2~4 times greater.
Keywords :
bipolar transistors; electrostatic discharge; thyristors; ESD optimization; deep submicron technology; floating P region; latchup-immune ESD protection SCR-incorporated BJT; optimized second breakdown current; parasitic NPN BJT; size 0.18 mum; triggering current; voltage 3.3 V; Failure analysis; Integrated circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
Conference_Location :
Suzhou
ISSN :
1946-1542
Print_ISBN :
978-1-4799-1241-4
Type :
conf
DOI :
10.1109/IPFA.2013.6599129
Filename :
6599129
Link To Document :
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