DocumentCode :
3037158
Title :
JTEC panel report on electronic manufacturing and packaging in Japan
Author :
Pecht, Michael ; Kelly, Michael ; Boulton, William ; Kukowski, John ; Meieran, Gene ; Peeples, John ; Tummala, Rao
Author_Institution :
Georgia Inst. of Technol., Atlanta, GA, USA
fYear :
1994
fDate :
12-14 Sep 1994
Firstpage :
96
Abstract :
Global competition in the electronics industry is offering unprecedented challenges to the industrial sector. Product lifecycles are shortening, development cycle times are decreasing, profit margins are declining, and new technology is readily available to anyone who aggressively pursues it. Japan has targeted electronics as an industry vital to its industrial success, and can, to a large degree, declare victory-particularly in the high-volume, low-cost electronic assembly industry. The question that the JTEC Electronic Packaging Panel was asked to answer was, why?
Keywords :
economics; electronic equipment manufacture; electronics industry; packaging; product development; production; JTEC panel report; Japan; electronics industry; electronics manufacturing; electronics packaging; global competition; high-volume electronic assembly; low-cost electronic assembly industry; Assembly; Computer displays; Computer peripherals; Consumer electronics; Economic indicators; Electronics industry; Electronics packaging; Industrial electronics; Manufacturing industries; Video equipment;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1994. Low-Cost Manufacturing Technologies for Tomorrow's Global Economy. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International
Conference_Location :
La Jolla, CA
Print_ISBN :
0-7803-2037-9
Type :
conf
DOI :
10.1109/IEMT.1994.404684
Filename :
404684
Link To Document :
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