DocumentCode
3037216
Title
High drain current (>2A/mm) InGaAs channel MOSFET at VD =0.5V with shrinkage of channel length by InP anisotropic etching
Author
Yonai, Yoshiharu ; Kanazawa, Toru ; Ikeda, Shunsuke ; Miyamoto, Yasuyuki
Author_Institution
Dept. of Phys. Electron., Tokyo Inst. of Technol., Tokyo, Japan
fYear
2011
fDate
5-7 Dec. 2011
Abstract
In this paper, we report InGaAs channel MOSFETs with an InP source contact. InP source contact enables the suppression of carrier starvation and the easy shrinkage of the channel length by anisotropic etching. In fabricated 50-nm InGaAs channel MOSFETs, ID = 2.4A/mm at VD=0.5V were observed. On the other hand, degradations of Vth and SS by the short channel effect were also observed. Thinner channels will be required in order to suppress this effect.
Keywords
III-V semiconductors; MOSFET; etching; gallium arsenide; indium compounds; InGaAs-InP; InP anisotropic etching; channel length; high drain current InGaAs channel MOSFET; size 50 nm; source contact; thinner channel; voltage 0.5 V; Dielectrics; Electrodes; Etching; Indium gallium arsenide; Indium phosphide; Logic gates; Resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting (IEDM), 2011 IEEE International
Conference_Location
Washington, DC
ISSN
0163-1918
Print_ISBN
978-1-4577-0506-9
Electronic_ISBN
0163-1918
Type
conf
DOI
10.1109/IEDM.2011.6131545
Filename
6131545
Link To Document