DocumentCode
3037314
Title
Development of system-on-a-chip design methodology and products using flexible interconnect architecture approach
Author
Yaakob, Wira Firdaus Hj ; Beg, Ahmad RaifMohamed Noor ; Rahman, A. A. Abdul ; Ahmad, Mohd Rais
Author_Institution
Microelectron. Lab., MIMOS Berhad, Kuala Lumpur, Malaysia
fYear
2000
fDate
2000
Firstpage
69
Lastpage
74
Abstract
Improvement of the traditional ASIC design methodology is targeted towards achieving significant increase in design productivity. This is especially critical in handling complex system-on-a-chip (SOC) products that allow only a short design cycle. In order to meet delivery times and avoid loss of opportunity to market, a technique that allows reuse of pre-designed intellectual properties (IPs) must be developed. Designers at MIMOS´ Microelectronics Lab focus on quick integration of CPU, peripherals and memory blocks to a flexible system interconnect architecture (IA) to aggressively shorten design time. This paper describes a versatile approach in IA-based SOC design and gives a detail accounts of integration of a variety of IPs to the IA
Keywords
application specific integrated circuits; circuit simulation; industrial property; integrated circuit design; integrated circuit interconnections; integrated circuit modelling; ASIC design methodology; CPU; IA-based SOC design; IP integration; delivery times; design cycle; design productivity; design time; flexible interconnect architecture; flexible system interconnect architecture; intellectual property reuse; memory blocks; peripherals; pre-designed intellectual properties; rapid integration; system-on-a-chip; system-on-a-chip design methodology; Application specific integrated circuits; Central Processing Unit; Design methodology; Integrated circuit interconnections; MIMO; Microelectronics; Productivity; Silicon; System-on-a-chip; Timing;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics, 2000. ICM 2000. Proceedings of the 12th International Conference on
Conference_Location
Tehran
Print_ISBN
964-360-057-2
Type
conf
DOI
10.1109/ICM.2000.916417
Filename
916417
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