• DocumentCode
    3037322
  • Title

    Process control of the lead scanning process [IC packages]

  • Author

    Kumar, Sanjoy ; Truesdale, Robert

  • Author_Institution
    Motorola Inc., Oak Hill, TX, USA
  • fYear
    1994
  • fDate
    12-14 Sep 1994
  • Firstpage
    93
  • Abstract
    The process flow of a scanner was thoroughly looked at. The process flow revealed that accuracy, repeatability, and handling of the parts are the key elements. Through research it was also determined that GR&R and design of experiments were necessary to optimize the scanner parameters. It was also determined that physical handling of the parts created more rejects. Therefore, for performing quality control gates we used full tube or tray quantities to eliminate the human factor. This drove the quality to new highs. There was also automation added to the existing scanners, but before releasing to production the key elements were thoroughly characterized. The SPC charts were also custom-made for the new scanner based on the confidence level of the modified machine. Initially, the frequency was high, but with statistical data, it was eventually back to normal conditions
  • Keywords
    bending; design of experiments; inspection; integrated circuit manufacture; integrated circuit packaging; quality control; statistical process control; IC package leads; SPC charts; automation; confidence level; design of experiments; lead scanning process; physical handling; process control; production; quality control; statistical data; Assembly; Bonding; Integrated circuit packaging; Integrated circuit testing; Lead; Plastic packaging; Process control; Semiconductor device packaging; Shape; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Manufacturing Technology Symposium, 1994. Low-Cost Manufacturing Technologies for Tomorrow's Global Economy. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International
  • Conference_Location
    La Jolla, CA
  • Print_ISBN
    0-7803-2037-9
  • Type

    conf

  • DOI
    10.1109/IEMT.1994.404685
  • Filename
    404685