DocumentCode
3037322
Title
Process control of the lead scanning process [IC packages]
Author
Kumar, Sanjoy ; Truesdale, Robert
Author_Institution
Motorola Inc., Oak Hill, TX, USA
fYear
1994
fDate
12-14 Sep 1994
Firstpage
93
Abstract
The process flow of a scanner was thoroughly looked at. The process flow revealed that accuracy, repeatability, and handling of the parts are the key elements. Through research it was also determined that GR&R and design of experiments were necessary to optimize the scanner parameters. It was also determined that physical handling of the parts created more rejects. Therefore, for performing quality control gates we used full tube or tray quantities to eliminate the human factor. This drove the quality to new highs. There was also automation added to the existing scanners, but before releasing to production the key elements were thoroughly characterized. The SPC charts were also custom-made for the new scanner based on the confidence level of the modified machine. Initially, the frequency was high, but with statistical data, it was eventually back to normal conditions
Keywords
bending; design of experiments; inspection; integrated circuit manufacture; integrated circuit packaging; quality control; statistical process control; IC package leads; SPC charts; automation; confidence level; design of experiments; lead scanning process; physical handling; process control; production; quality control; statistical data; Assembly; Bonding; Integrated circuit packaging; Integrated circuit testing; Lead; Plastic packaging; Process control; Semiconductor device packaging; Shape; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 1994. Low-Cost Manufacturing Technologies for Tomorrow's Global Economy. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International
Conference_Location
La Jolla, CA
Print_ISBN
0-7803-2037-9
Type
conf
DOI
10.1109/IEMT.1994.404685
Filename
404685
Link To Document