DocumentCode
3037338
Title
Uniform delayering of copper metallization
Author
Siah, Y.W. ; Hong, Young June ; Liu, Quanwei ; Kor, H.B. ; Gan, C.L.
Author_Institution
Temasek Labs., Nanyang Technol. Univ., Singapore, Singapore
fYear
2013
fDate
15-19 July 2013
Firstpage
166
Lastpage
169
Abstract
Integrated circuit chips of newer technology usually have a larger die size and an increase number of metallization. Hence, pure usage of polishing to remove the layers would induce severe edge rounding. An alternative method is proposed to decrease the polishing time for copper metallization removal while reducing edge rounding on the sample during sample preparation that will preserve the integrity of the layers for further failure analysis.
Keywords
copper; failure analysis; integrated circuit metallisation; integrated circuit reliability; polishing; specimen preparation; Cu; copper metallization removal; failure analysis; integrated circuit chip; polishing; sample preparation; severe edge rounding; uniform delayering; Decision support systems; Failure analysis; Integrated circuits; Delayering; copper metallization; polishing; sample preparation;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
Conference_Location
Suzhou
ISSN
1946-1542
Print_ISBN
978-1-4799-1241-4
Type
conf
DOI
10.1109/IPFA.2013.6599147
Filename
6599147
Link To Document