DocumentCode
3037490
Title
Technology roadmaps and low power SoC design
Author
Yeric, Greg
Author_Institution
R&D, ARM, Austin, TX, USA
fYear
2011
fDate
5-7 Dec. 2011
Abstract
Significant change in technology is forecast in the next few process nodes, including the introduction of new transistor structures and increasingly limited interconnect scaling. Technology characteristics drive the planning and optimization of micro-architectures, whose abstracted characteristics are then used to forecast System-on-Chip (SoC) trends in power, performance, and area (PPA). For the coming nodes, extrapolating past trends will not suffice, as entirely new architectures may be better suited to a new technology landscape. This paper will discuss low power design prediction, relating technology roadmap information to circuit metrics, and explore areas for improvement.
Keywords
integrated circuit design; low-power electronics; system-on-chip; circuit metrics; interconnect scaling; low power SoC design; micro-architectures; power performance and area; process nodes; system-on-chip; technology roadmap information; transistor structures; Benchmark testing; Integrated circuit modeling; Logic gates; Predictive models; Semiconductor process modeling; System-on-a-chip; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting (IEDM), 2011 IEEE International
Conference_Location
Washington, DC
ISSN
0163-1918
Print_ISBN
978-1-4577-0506-9
Electronic_ISBN
0163-1918
Type
conf
DOI
10.1109/IEDM.2011.6131559
Filename
6131559
Link To Document