• DocumentCode
    3037556
  • Title

    Design-friendly scalability of cost-effective 28LP technology platform featuring 2nd generation gate-first HK/MG transistors without eSiGe

  • Author

    Fukutome, H. ; Kim, D.H. ; Hwang, S.M. ; Jeong, L.G. ; Kim, S.C. ; Kim, J.C. ; Nakamatsu, I. ; Jung, M.K. ; Lee, W.C. ; Kim, Y.S. ; Kwon, S.D. ; Lyu, G.H. ; Youn, J.M. ; Oh, Y.M. ; Park, M.H. ; Ku, J.H. ; Lee, N. -I ; Jung, E.S. ; Paak, S.

  • Author_Institution
    Samsung Electron. Co., Ltd., Yongin, South Korea
  • fYear
    2011
  • fDate
    5-7 Dec. 2011
  • Abstract
    Scalability of the 28nm gate-first high-k/metal gate (HK/MG) LP devices with maintaining the performance and layout flexibility was comprehensively studied for the first time. We demonstrated the N-/PFET drive current (Idsat) of 0.86/0.46 mA/μm with the off-leakage current (Ioff) of 1 nA/μm for the supply voltage (Vdd) of 1V by the simple method suitable for scaling the circuit area whereas the local fluctuation in threshold voltage (Vt) was reduced (Avt(N/P)=1.45/1.55, which could make the SRAM cell size scaled down by 6%). We investigated the dependence of the electrical characteristics of such gate-first HK/MG devices on both the gate width (Wg) and gate pitch (Pgg) to show the geometric scalability of the gate electrode. We also evaluated the dependence of them on both the length of active region (LOD) and distance between two active regions to show the scalability of the active region for increasing the transistor density. Finally, we found that the systematic variation related with the flexible gate layout could be suppressed.
  • Keywords
    SRAM chips; field effect memory circuits; flexible electronics; high-k dielectric thin films; integrated circuit layout; leakage currents; NFET drive current; PFET drive current; SRAM cell size; circuit area scaling; cost-effective 28LP technology platform; design-friendly scalability; flexible gate layout; gate electrode scalability; gate pitch; gate width; gate-first high-k-metal gate LP devices; length of active region; off-leakage current; performance flexibility; second generation gate-first HK-MG transistors; size 28 nm; supply voltage; threshold voltage reduction; transistor density; voltage 1 V; Degradation; Fluctuations; Layout; Logic gates; Performance evaluation; Scalability; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting (IEDM), 2011 IEEE International
  • Conference_Location
    Washington, DC
  • ISSN
    0163-1918
  • Print_ISBN
    978-1-4577-0506-9
  • Electronic_ISBN
    0163-1918
  • Type

    conf

  • DOI
    10.1109/IEDM.2011.6131561
  • Filename
    6131561