Title :
Solder joint fatigue: comparison of hand soldering to vapor phase soldering on surface mounted components for aerospace applications
Author :
Bevan, Matthew G. ; Charles, Harry K., Jr.
Author_Institution :
Appl. Phys. Lab., Johns Hopkins Univ., MD, USA
Abstract :
The solder fatigue life of hand-soldered joints was compared to vapor-phase-soldered joints by thermal cycling circuit cards populated with surface-mount components. Four package types were tested: two sizes of chip components (2512 and 0805), 14-pin gull wing flatpacks and 44-pin leadless ceramic chip carriers. Various process flows were correlated with solder joint reliability. The test samples were temperature cycled, over 7500 cycles from -30°C to +100°C for more than a year. Results of the temperature cycling indicate several interesting trends including some which are counter to expectations. Differences in component form and solder joint properties are likely explanations
Keywords :
assembling; circuit reliability; failure analysis; fatigue; printed circuit manufacture; soldering; surface mount technology; thermal stress cracking; -30 to 100 C; 1 year; 14-pin gull wing flatpacks; 44-pin LCCC; PC assembly; SMD; SMT assemblies; aerospace applications; chip components; circuit cards; hand soldering; joint reliability; leadless ceramic chip carriers; package types; solder fatigue life; solder joint fatigue; soldered joints; surface mounted components; temperature cycling; thermal cycling; vapor phase soldering; Aerospace industry; Aerospace testing; Ceramics; Circuit testing; Fatigue; Joining processes; Lead; Packaging; Soldering; Temperature control;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1994. Low-Cost Manufacturing Technologies for Tomorrow's Global Economy. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International
Conference_Location :
La Jolla, CA
Print_ISBN :
0-7803-2037-9
DOI :
10.1109/IEMT.1994.404687
