DocumentCode
3037792
Title
Design Challenges for Mobile Communication Devices
Author
Kutter, Christoph
Author_Institution
Bus. Group Commun. Solutions, Infineon Technol. AG, Munich
fYear
2006
fDate
4-6 Oct. 2006
Firstpage
1
Lastpage
1
Abstract
Summary form only given. System on chips (SoC) for mobile devices, such as GSM/EDGE/UMTS, have strongly conflicting requirements. On one hand the demand for processing performance is steadily increasing with every new standard and on the other hand extremely low power dissipation is demanded. The performance demands vary strongly, depending on the phone modes and activities e.g. stand-by mode vs. talk mode vs. high performance application modes such as video processing and gaming. Next to the development of new telecommunication standards the silicon technologies develop according to the shrink path. Scaling of physical structures, especially the gate thickness, induces larger leakage in DSM technologies. The shrink is accompanied with a further reduction of supply voltage that helps to reduce the dynamic power dissipation but also reduces the leverage of performance improvement. To reduce the leakage and to reach the targets of design projects new low power measures have to be defined and implemented by integration into technology, libraries, design tools, and the design flow. In recent years several low power features have been developed to address both the static leakage power consumption and the dynamic active power consumption. These features, or a combination of them, can be tailored to dynamically varying performance needs of the SoC in different modes meaning different use cases
Keywords
3G mobile communication; cellular radio; low-power electronics; silicon; system-on-chip; telecommunication standards; EDGE; GSM; UMTS; deep submicron technologies; low power dissipation; mobile communication devices; silicon technologies; stand by mode; system on chips; talk mode; telecommunication standards; 3G mobile communication; Dynamic voltage scaling; Energy consumption; GSM; Mobile communication; Power dissipation; Power measurement; Silicon; System-on-a-chip; Telecommunication standards; Design; Design for Low Power; Leakage; Management; SoC;
fLanguage
English
Publisher
ieee
Conference_Titel
Low Power Electronics and Design, 2006. ISLPED'06. Proceedings of the 2006 International Symposium on
Conference_Location
Tegernsee
Print_ISBN
1-59593-462-6
Type
conf
DOI
10.1109/LPE.2006.4271797
Filename
4271797
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