Title :
On clustering of defects and yield of SMT assemblies
Author :
Tegethoff, Mick M V ; Chen, Tom W.
Author_Institution :
Hewlett-Packard Co., Fort Collins, CO, USA
Abstract :
This paper describes a clustered yield model for complex Surface Mount Technology (SMT) assemblies. The model uses the negative binomial distribution of defects to calculate board yield after test. Manufacturing data validates that this model accurately predicts the clustering of defects and the yield predictions are significantly better than traditional binomial models
Keywords :
binomial distribution; design for manufacture; design for testability; modelling; printed circuit manufacture; surface mount technology; SMT assemblies; board yield; clustered yield model; defects clustering; negative binomial distribution; surface mount technology; yield prediction; Assembly; Circuit faults; Design for manufacture; Integrated circuit yield; Predictive models; Production; Surface-mount technology; Testing; Virtual manufacturing; Yield estimation;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1994. Low-Cost Manufacturing Technologies for Tomorrow's Global Economy. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International
Conference_Location :
La Jolla, CA
Print_ISBN :
0-7803-2037-9
DOI :
10.1109/IEMT.1994.404688
