• DocumentCode
    3038060
  • Title

    Impact of Technology and Voltage Scaling on the Soft Error Susceptibility in Nanoscale CMOS

  • Author

    Chandra, Vikas ; Aitken, Robert

  • fYear
    2008
  • fDate
    1-3 Oct. 2008
  • Firstpage
    114
  • Lastpage
    122
  • Abstract
    With each technology node shrink, a silicon chip becomes more susceptible to soft errors. The susceptibility further increases as the voltage is scaled down to save energy. Based on analysis on cells from commercial libraries, we have quantified the increase in the soft error probability across 65 nm and 45 nm technology nodes at different supply voltages using the Qcrit based simulation methodology. The Qcrit for both bit cells and latches decreases by ~30% as the designs are scaled from 65 nm to 45 nm. This decrease is expected to continue with further technology scaling as well. The results show that at nominal voltage, the Qcrit for a latch is just ~20% more than that of the bit cell in sub-65nm technology nodes. Further, as the voltage is scaled from 1 V to 0.4 V, Qcrit decreases by ~5X which substantially increases the probability of an upset if a particle strike happens. This work shows that in sub-65 nm technology nodes with aggressive voltage scaling, it is equally critical to solve the soft error problems in logic (latches, flip-flops) as it is in SRAMs.
  • Keywords
    CMOS integrated circuits; SRAM chips; elemental semiconductors; error statistics; silicon; Qcrit based simulation methodology; SRAM; Si; nanoscale CMOS; node shrink technology; silicon chip; size 45 nm; size 65 nm; soft error probability; soft error susceptibility; voltage 1 V to 0.4 V; voltage scaling; CMOS technology; Capacitance; Dynamic voltage scaling; Error probability; Flip-flops; Latches; Logic; Research and development; Silicon; Single event upset; Soft error; Technology Scaling; Voltage Scaling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Defect and Fault Tolerance of VLSI Systems, 2008. DFTVS '08. IEEE International Symposium on
  • Conference_Location
    Boston, MA
  • ISSN
    1550-5774
  • Print_ISBN
    978-0-7695-3365-0
  • Type

    conf

  • DOI
    10.1109/DFT.2008.50
  • Filename
    4641164