DocumentCode :
3038203
Title :
Application of TEM for distinguishing the primary and secondary abrasives of undiluted CMP slurry
Author :
Sun, C.J. ; Tai, L.A. ; Sharma, Parmanand ; Ko, Y.F. ; Chen, Yu Christine ; Chu, C.H. ; Hsieh, Y.F. ; Yang, C.S. ; Yew, T.R.
Author_Institution :
Center for Nanomedicine Res., Nat. Health Res. Inst., Zhunan, Taiwan
fYear :
2013
fDate :
15-19 July 2013
Firstpage :
400
Lastpage :
403
Abstract :
Determination of morphology and size distribution of primary and secondary abrasives of slurry is essential for optimization of CMP performance. The undiluted slurry was characterized in liquid phase using silicon based Nano-pipettes in TEM. To validate utility of Nano-pipettes, comparatively quantitative analysis was performed by cryo-TEM technique.
Keywords :
abrasives; chemical mechanical polishing; silicon; transmission electron microscopy; CMP performance optimization; cryo-TEM technique; liquid phase; morphology determination; primary abrasive; quantitative analysis; secondary abrasive; silicon based nano-pipettes; size distribution; undiluted CMP slurry; Decision support systems; Failure analysis; Integrated circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
Conference_Location :
Suzhou
ISSN :
1946-1542
Print_ISBN :
978-1-4799-1241-4
Type :
conf
DOI :
10.1109/IPFA.2013.6599189
Filename :
6599189
Link To Document :
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