DocumentCode
3038225
Title
Future automotive electronic systems and their impact on solid-state-circuits
Author
Ziebart, W.
Author_Institution
Bayerische Motoren Werke AG, Munchen, Germany
fYear
1992
fDate
19-21 Feb. 1992
Firstpage
20
Lastpage
22
Abstract
The current status of automobile electronics is surveyed, and the relationship between automobile electronics and the semiconductor industry is examined. To achieve the evolution of the auto electronic system described, progress in three major areas of semiconductor technology is necessary: (1) power single chip microcomputers are needed for the computing center; (2) combined logic and power devices are needed for remote electronics in intelligent peripherals, and (3) new packaging technologies are required for semiconductor devices in these peripherals. It is concluded that, to achieve the necessary objectives, a much better understanding of the mutual problems in the semiconductor and the auto industry is necessary. The auto industry must have a better understanding of the semiconductor learning curve, and the technological progress that can be made over time. The semiconductor industry, where progress is mainly driven by the demands of the computer business, should spend more resources on, meeting the special requirements of the auto industry.<>
Keywords
automotive electronics; digital integrated circuits; digital systems; monolithic integrated circuits; packaging; power integrated circuits; automobile electronics; automotive electronic systems; in intelligent peripherals; packaging technologies; power single chip microcomputers; remote electronics; semiconductor industry; semiconductor technology; solid-state-circuits; Automobiles; Automotive electronics; Computer peripherals; Electronics industry; Electronics packaging; Industrial electronics; Logic devices; Microcomputers; Semiconductor device packaging; Semiconductor devices;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference, 1992. Digest of Technical Papers. 39th ISSCC, 1992 IEEE International
Conference_Location
San Francisco, CA, USA
Print_ISBN
0-7803-0573-6
Type
conf
DOI
10.1109/ISSCC.1992.200392
Filename
200392
Link To Document