DocumentCode
3038315
Title
Three-dimensional characterization of crystalline grains in sub-100 nm Cu lines by Transmission Electron Microtomography
Author
Ito, Toshihiko ; Matsuwaki, Ukyo ; Naijou, Takanori ; Hashimoto, Hideki ; Tarumi, Nobuaki ; Ogawa, Shinichi
Author_Institution
Toray Res. Center, Inc., Otsu, Japan
fYear
2010
fDate
6-9 June 2010
Firstpage
1
Lastpage
3
Abstract
The high resolution Transmission Electron Microtomography (TEMT) for characterization of grains in a Cu sub-100nm line was firstly reported. A new sample preparation method was developed for obtaining TEM projections from the tilted sample from -90 to +90 degrees. A Cu grain structure was become clear by the 3D TEMT. Furthermore grooving at the surface and micro voids of a few nm were found at the grain boundaries.
Keywords
integrated circuit interconnections; tomography; transmission electron microscopy; 3D TEMT; Cu; Cu grain structure; Cu lines; crystalline grains; high resolution transmission electron microtomography; three-dimensional characterization; Acceleration; Computed tomography; Crystallization; Diffraction; Grain boundaries; Grain size; Image reconstruction; Image resolution; Shape; Transmission electron microscopy;
fLanguage
English
Publisher
ieee
Conference_Titel
Interconnect Technology Conference (IITC), 2010 International
Conference_Location
Burlingame, CA
Print_ISBN
978-1-4244-7676-3
Type
conf
DOI
10.1109/IITC.2010.5510697
Filename
5510697
Link To Document