DocumentCode
3038393
Title
Design and fabrication of high accuracy GaAs Hall effect sensor grown by molecular beam epitaxy
Author
Mohades-Kassai, A. ; Soufi, H.R.
Author_Institution
Electron. Res. Center, Iran Univ. of Sci. & Technol., Tehran, Iran
fYear
2000
fDate
2000
Firstpage
345
Lastpage
348
Abstract
A thin GaAs Hall effect sensor with good thermal stability has been grown by molecular beam epitaxy (MBE). This sensor transduces magnetic flux to a voltage signal. The Hall effect involves passing a current through a layer of semiconductor when a magnetic field is applied perpendicularly to the surface of the layer; a voltage is developed across the sides of the semiconductor which is directly proportional to the applied magnetic field. In order to meet the entire requirement of correct measurement and minimize errors, the GaAs layer was cut into a clover-leaf shape by means of a fine-nozzle sandblaster. The ohmic contacts were then formed by sintering indium into the GaAs layer in the presence of HCl gas
Keywords
Hall effect transducers; III-V semiconductors; electric sensing devices; gallium arsenide; magnetic flux; magnetic sensors; molecular beam epitaxial growth; ohmic contacts; semiconductor growth; sintering; thermal stability; GaAs; GaAs Hall effect sensor; GaAs layer cutting; GaAs:In; HCl; HCl gas sintering atmosphere; Hall effect; In sintering; MBE; applied magnetic field; clover-leaf shape; current; design; error minimization; fine-nozzle sandblaster; magnetic flux; measurement accuracy; molecular beam epitaxy; ohmic contacts were; semiconductor layer; semiconductor voltage; thermal stability; thin GaAs Hall effect sensor; voltage signal; Fabrication; Gallium arsenide; Hall effect devices; Magnetic field measurement; Magnetic flux; Magnetic sensors; Molecular beam epitaxial growth; Shape measurement; Thermal stability; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics, 2000. ICM 2000. Proceedings of the 12th International Conference on
Conference_Location
Tehran
Print_ISBN
964-360-057-2
Type
conf
DOI
10.1109/ICM.2000.916474
Filename
916474
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