Title :
Failure mechanisms detected in memory chips during routine construction analysis
Author :
Brown, Sue ; Campbell, Jeff ; Griffin, Sherri ; James, Dick ; Haythornthwaite, Ray
Author_Institution :
Chipworks Inc., USA
Abstract :
Construction analysis is a useful tool to determine microcircuit structure and identify potential failure mechanisms. Cross sectioning procedures used in construction analysis have revealed two possible failure mechanisms. One mechanism involving the use of SOG results in poor adhesion and delamination. The other mechanism permits the corrosion of internal conductors through a combination of discontinuities in the passivation at growth boundaries and internal damage
Keywords :
adhesion; corrosion testing; delamination; failure analysis; integrated circuit reliability; integrated circuit testing; integrated memory circuits; passivation; SOG; adhesion; cross sectioning procedures; delamination; failure mechanisms; growth boundaries; internal conductor corrosion; internal damage; memory chips; microcircuit structure; passivation; routine construction analysis; spin on glass; Adhesives; Building materials; Conducting materials; Corrosion; Failure analysis; Moisture; Packaging; Passivation; Reverse engineering; Silicon;
Conference_Titel :
Memory Technology, Design and Testing, 1999. Records of the 1999 IEEE International Workshop on
Conference_Location :
San Jose, CA
Print_ISBN :
0-7695-0259-8
DOI :
10.1109/MTDT.1999.782681
