X-ray inspection of solder joints by planar computer tomography (PCT)

Author

Neubauer, C. ; Schröpfer, S. ; Hanke, R.

Author_Institution

Fraunhofer-Inst. for Integrated Circuits, Erlangen, Germany

fYear

1994

fDate

12-14 Sep 1994

Firstpage

60

Abstract

A new algorithm for 3D-reconstruction of objects from X-ray projections, called Planar Computer Tomography (PCT), is applied to inspection of solder joints. In contrast to axial computer tomography reconstruction is based on linear object movements instead of axial rotation. By this the handling of the Printed Circuit Board is simplified and integration into the conventional X-ray inspection process is enabled. Since the algorithm is well suited for parallel computers and only a few projections are necessary a significant speed up will be achieved compared with axial Computer Tomography (CT) and other 3D inspection techniques

Keywords

X-ray imaging; computerised tomography; image reconstruction; inspection; printed circuit manufacture; soldering; 3D-reconstruction; X-ray inspection; X-ray projections; linear object movements; parallel computing; planar computer tomography; printed circuit board; solder joints; Computed tomography; Concurrent computing; Distributed computing; Image reconstruction; Inspection; Printed circuits; Reconstruction algorithms; Soldering; Subspace constraints; X-ray imaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1994. Low-Cost Manufacturing Technologies for Tomorrow's Global Economy. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International

Conference_Location

La Jolla, CA

Print_ISBN

0-7803-2037-9

Type

conf

DOI

10.1109/IEMT.1994.404691

Filename

404691