Title :
Study of abnormal appearances on the failed die by FIB milling technology
Author :
Liyuan Liu ; Guangning Xu ; Fuyao Mo
Author_Institution :
Reliability Res. & Anal. Center, China CEPREI Lab., Guangzhou, China
Abstract :
Different abnormal appearances would usually be observed on dies of failed devices after decapsulation. In this paper, cases of failure analysis on typical abnormal appearances were introduced, such as discoloration region observed by metallographic microscope, fused/arching lines, common burnout of metallization on surface and uncovered by Photon Emission Microscope (EMMI) result, etc. It showed a simple and distinct way to study on the causation of abnormal appearances based on Focused Ion Beam (FIB) milling technology. Meanwhile the advantage of strong applicability was presented also.
Keywords :
focused ion beam technology; milling; semiconductor device manufacture; FIB milling technology; decapsulation; discoloration region; failed die; failure analysis; focused ion beam milling technology; fused/arching lines; metallographic microscope; photon emission microscope; Decision support systems; Failure analysis; Integrated circuits;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
Conference_Location :
Suzhou
Print_ISBN :
978-1-4799-1241-4
DOI :
10.1109/IPFA.2013.6599214
