Title :
Development of high resolution scanning aeoustie tomograph for advanced LSI packages
Author :
Kitami, Kaoru ; Takada, Masumi ; Kikuchi, Osamu ; Ohno, S.
Author_Institution :
Hitachi Power Solutions Co., Ltd., Hitachi, Japan
Abstract :
We have newly developed a scanning acoustic tomograph with higher resolution and detectability than the conventional type. The system can be equipped with a special signal processing unit that has been designed in order to emphasize the high frequency component of ultrasound. The signal processing unit enhanced the resolution and signal to noise ratio. Because of improvement in the signal to noise ratio, a slit with a width of 1 μm was detected by the new system with the signal processing unit.
Keywords :
acoustic tomography; integrated circuit packaging; large scale integration; signal detection; signal resolution; advanced LSI packaging; high resolution scanning acoustic tomograph; signal processing unit; signal to noise ratio; size 1 mum; ultrasound frequency component; Failure analysis; Integrated circuits;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
Conference_Location :
Suzhou
Print_ISBN :
978-1-4799-1241-4
DOI :
10.1109/IPFA.2013.6599215
