• DocumentCode
    3039036
  • Title

    Cu - based catalysts can make CMOS compatible Si nanowires: Toward reconfigurable interconnects

  • Author

    Jousseaume, V. ; Renard, V.T.

  • Author_Institution
    LETI-Minatec, CEA, Grenoble, France
  • fYear
    2010
  • fDate
    6-9 June 2010
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    CMOS compatible nanowires provide an interesting opportunity to integrate logic functions in interconnects levels. We report here the development of a method to grow silicon nanowire using back-end-of-line compatible copper-based catalysts. Our approach is based on oxidation of copper prior to growth and allows reducing silicon nanowire synthesis temperature below 450°C, a Back-end-of-line compatible temperature range. New functionalities permitted by silicon nanowires may therefore be added to interconnection levels.
  • Keywords
    CMOS integrated circuits; copper; integrated circuit interconnections; nanowires; silicon; CMOS compatible nanowires; Cu; interconnection levels; logic functions; reconfigurable interconnects; silicon nanowire synthesis; Chemical vapor deposition; Copper; Fabrication; Gold; III-V semiconductor materials; Logic functions; Nanowires; Semiconductor diodes; Silicon; Temperature distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Interconnect Technology Conference (IITC), 2010 International
  • Conference_Location
    Burlingame, CA
  • Print_ISBN
    978-1-4244-7676-3
  • Type

    conf

  • DOI
    10.1109/IITC.2010.5510748
  • Filename
    5510748