Title :
A CMOS sensor and signal conversion chip for monitoring arterial blood pressure and temperature
Author :
Spiegel, E. ; Kandler, M. ; Manoli, Y. ; Mokwa, W.
Author_Institution :
Fraunhofer Inst. of Microelectron. Circuits & Syst., Duisburg, Germany
Abstract :
In medical intensive care, measurement of vital blood parameters is time-consuming and can be inconvenient to the patient. A system which processes the signals of the on-chip pressure and temperature sensors is presented. This includes signal conditioning and amplification using switch-capacitor techniques. Multiplexing some blocks helps to reduce chip area. To minimize noise sensitivity, digital transmission using a pulsewidth modulated signal is implemented. This also reduces the number of connections to five wires for power and ground, a clock for timing and running the switch-capacitor circuitry, and two lines for digital transmission and control. Using a 3- mu m CMOS process optimized for highly reliable analog circuits, the chip size can be limited to 7.2*0.7 mm/sup 2/. The chip can be embedded in a catheter 1 mm in diameter, at the same time allowing injection of medicine directly into the arterial blood stream. The catheter chip presented is part of a monitoring system that allows the doctor to do online analysis of blood pressure and temperature.<>
Keywords :
CMOS integrated circuits; biomedical electronics; biothermics; blood; electric sensing devices; haemodynamics; patient monitoring; pressure transducers; temperature measurement; 3 micron; CMOS process; arterial blood pressure; blood parameters; catheter; chip area; chip size; medical intensive care; noise sensitivity; online analysis; pressure sensors; pulsewidth modulated signal; signal conditioning; signal conversion chip; switch-capacitor techniques; temperature monitoring; temperature sensors; Biomedical monitoring; Blood; Catheters; Circuit noise; Patient monitoring; Pulse amplifiers; Semiconductor device measurement; Signal processing; System-on-a-chip; Temperature sensors;
Conference_Titel :
Solid-State Circuits Conference, 1992. Digest of Technical Papers. 39th ISSCC, 1992 IEEE International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-0573-6
DOI :
10.1109/ISSCC.1992.200444