DocumentCode :
3039490
Title :
New Technologies for Improving the High Frequency Performance of AlGaN/GaN High Electron Mobility Transistors
Author :
Chung, J.W. ; Piner, E.L. ; Roberts, J.C. ; Palacios, T.
Author_Institution :
Microsyst. Technol. Labs., Massachusetts Inst. of Technol., Cambridge, MA
fYear :
2008
fDate :
Sept. 29 2008-Oct. 4 2008
Firstpage :
66
Lastpage :
71
Abstract :
In this paper, we have used a combination of physical analysis, numerical simulation and experimental work to overcome some of the main challenges in AlGaN/GaN high electron mobility transistors (HEMTs) for high frequency applications. In spite of their excellent material properties, GaN-based HEMTs are still below the theoretical predictions in their high frequency performance. If the frequency performance could be improved, the superior breakdown characteristics of nitride semiconductors would make these devices the best option for power amplifiers at Ka and even W band frequencies. To achieve this goal, we have first identified some of the critical parameters that limit the high frequency performance of AlGaN/GaN HEMTs and we have demonstrated several technologies to increase the performance. Some of these technologies include deep-submicron T-gate technology, thin-body GaN HEMTs, and advanced drain delay engineering.
Keywords :
aluminium compounds; gallium compounds; high electron mobility transistors; power amplifiers; AlGaN-GaN; HEMT; W band frequencies; deep-submicron T-gate technology; drain delay engineering; high electron mobility transistor; power amplifier; Aluminum gallium nitride; Electric breakdown; Frequency; Gallium nitride; HEMTs; MODFETs; Material properties; Numerical simulation; Semiconductor device breakdown; Semiconductor optical amplifiers; AlGaN/GaN HEMTs; T-gate; drain delay; thin-body GaN;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advances in Electronics and Micro-electronics, 2008. ENICS '08. International Conference on
Conference_Location :
Valencia
Print_ISBN :
978-0-7695-3370-4
Electronic_ISBN :
978-0-7695-3370-4
Type :
conf
DOI :
10.1109/ENICS.2008.36
Filename :
4641238
Link To Document :
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