Title :
VIA/BGA/sup (R)/: a low-cost, high-performance packaging technology for broadband telecommunications
Author :
Panicker, M.P.R. ; Hyslop, M.S. ; Nelson, S. ; Mongia, R. ; Ewy, E.
Author_Institution :
Micro Substrates Corp., Tempe, AZ, USA
Abstract :
A ceramic BGA packaging technology for broadband applications such as LMDS and SONET/SDH is described. The package is designed for the bandwidth of DC-32 GHz. Manufactured on VIA/PLANE/sup (R)/ using semiconductor processing techniques in an array format, it provides the ability to assemble and test the devices in arrays for maximum productivity. The paper describes the electromagnetic modeling, design, manufacture and testing of the package. Its electrical performance is compared with the theoretical model. The thermal model of the package with device on PCB is also presented. The package attributes are compared with the conventional leaded, microstrip/stripline and leadless formats.
Keywords :
SONET; broadband networks; ceramic packaging; integrated circuit manufacture; integrated circuit testing; millimetre wave integrated circuits; semiconductor device models; synchronous digital hierarchy; telecommunication equipment; telecommunication equipment testing; thermal analysis; 32 GHz; LMDS; MM-wave BGA technology; PCB; SONET/SDH; VIA/BGA; VIA/PLANE; array format; bandwidth; broadband telecommunications; ceramic BGA packaging technology; electrical performance; electromagnetic modeling; high-performance packaging technology; leaded format; leadless format; low-cost packaging technology; maximum productivity; microstrip/stripline format; package design; package manufacture; package testing; semiconductor processing techniques; thermal model; Assembly; Bandwidth; Ceramics; Manufacturing processes; SONET; Semiconductor device manufacture; Semiconductor device packaging; Semiconductor device testing; Semiconductor process modeling; Synchronous digital hierarchy;
Conference_Titel :
Emerging Technologies Symposium: Broadband, Wireless Internet Access, 2000 IEEE
Conference_Location :
Richardson, TX, USA
Print_ISBN :
0-7803-6364-7
DOI :
10.1109/ETS.2000.916535
