Title :
Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)
Abstract :
The following topics were dealt with. Adhesives; underfills; encapsulants and coatings; bumping processes; solders; HDI; reliability; thermal management; and passive materials
Keywords :
adhesives; coatings; encapsulation; packaging; reliability; soldering; HDI; adhesives; bumping processes; coatings; encapsulants; passive materials; reliability; solders; thermal management; underfills;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on
Conference_Location :
Braselton, GA, USA
Print_ISBN :
0-930815-64-5
DOI :
10.1109/ISAOM.2001.916538
