Title :
High thermally conductive underfill for flip-chip applications
Author :
Suzuki, Kenichi ; Suzuki, Osamu ; Muramatu, Kazuo ; Yuda, Toshihide ; Isobe, Kohei ; Maruyama, Hideki ; Fukuyama, Hiroyuki
Author_Institution :
R&D Dept., NAMICS Corp., Niigata, Japan
Abstract :
High thermal conductivity underfill has been developed. The underfill is filled with fine particle size aluminum nitride that provides the high thermal conductivity and good fluidity. Also, this product satisfies the basic requirements for underfill, such as the Level 3 JEDEC preconditioning test. This paper presents work in developing an approach to underfill material for flip-chip packaging using aluminum nitride
Keywords :
aluminium compounds; encapsulation; filled polymers; flip-chip devices; integrated circuit packaging; integrated circuit testing; particle reinforced composites; particle size; thermal conductivity; AlN; Level 3 JEDEC preconditioning test; aluminum nitride; fine particle size aluminum nitride; flip-chip applications; flip-chip packaging; fluidity; thermal conductivity; thermally conductive underfill; underfill; underfill material; Aluminum nitride; Conducting materials; Electrical resistance measurement; Materials science and technology; Packaging; Silicon compounds; Thermal conductivity; Thermal factors; Thermal management; Thermal resistance;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-930815-64-5
DOI :
10.1109/ISAOM.2001.916547
