Title :
Multi-level 40nm WOX resistive memory with excellent reliability
Author :
Chien, Wei-Chih ; Lee, Ming-Hsiu ; Feng-Ming Lee ; Lin, Yu-Yu ; Lung, Hsiang-Lan ; Hsieh, Kuang-Yeu ; Lu, Chih-Yuan
Author_Institution :
Emerging Central Lab., Macronix Int. Co. Ltd., Hsinchu, Taiwan
Abstract :
40nm WOX ReRAM has several unique characteristics that are very favorable for MLC application. (1) Although the resistance has strong temperature dependence (as for all ReRAM´s) the J-V characteristics can be accurately described, thus all MLC levels are easily modeled. (2) The device is immune to over-erase, thus allow fast MLC programming. (3) The programming is self-converging (as Flash memories) and is independent of history. Thus an algorithm similar to ISPP (Incremental Step Pulse Programming), commonly used by MLC NAND flash, is designed to achieve accurate MLC states. Consequently, fast 50ns switching, 2-bit/cell and 3-bit/cell MLC states with good cycling characteristics and low read disturbance (>; 1010) is achieved.
Keywords :
CMOS memory circuits; NAND circuits; flash memories; integrated circuit reliability; random-access storage; tungsten compounds; ISPP; J-V characteristic; MLC NAND flash; MLC application; MLC programming; WOx; incremental step pulse programming; multilevel ReRAM; multilevel resistive memory; size 40 nm; time 50 ns; Flash memory; Mathematical model; Programming; Resistance; Switches; Temperature; Temperature dependence;
Conference_Titel :
Electron Devices Meeting (IEDM), 2011 IEEE International
Conference_Location :
Washington, DC
Print_ISBN :
978-1-4577-0506-9
Electronic_ISBN :
0163-1918
DOI :
10.1109/IEDM.2011.6131651