Title :
New solderless connection technology using light-setting insulation resin
Author :
Nagao, Koichi ; Nishihara, Kazunari ; Fujimoto, Hiroaki ; Hatada, Kenzo
Author_Institution :
Semicond. Res. Center, Matsushita Electr. Ind. Co. Ltd., Osaka, Japan
Abstract :
A new solderless connection technology using light-setting insulation resin has been developed. This makes possible fine-pitch and short length connection between the FPC (Flexible Printed Circuit) and the electrodes of an electronic device. An FPC is attached by the adhesive force of the light-setting insulation resin. This technology has been applied to a thin-film magnetic head, and realized ultra fine connection, i.e. a connection pitch of 75 μm (present ratio 1/2) and a connection length of 250 μm (present ratio 1/10)
Keywords :
adhesion; fine-pitch technology; joining processes; magnetic heads; magnetic thin film devices; organic insulating materials; polymer films; printed circuit accessories; 250 mum; 75 mum; UV irradiation energy level; V-I characteristics; adhesive force; connection length; connection pitch; electronic device electrodes; fine-pitch connection; flexible printed circuit connection; humidity test; light-setting insulation resin; short length connection; solderless connection technology; thin-film magnetic head; ultra fine connection; Contacts; Dielectrics and electrical insulation; Electrodes; Flexible printed circuits; Lead; Magnetic films; Magnetic heads; Manufacturing; Resins; Soldering;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1994. Low-Cost Manufacturing Technologies for Tomorrow's Global Economy. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International
Conference_Location :
La Jolla, CA
Print_ISBN :
0-7803-2037-9
DOI :
10.1109/IEMT.1994.404697
