DocumentCode :
3039831
Title :
Silicon bipolar mixed-signal parameterized-cell array for wireless applications to 4 GHz
Author :
Negus, K.J. ; Koupal, R.A. ; Millicker, D. ; Snapp, C.P.
Author_Institution :
Avantek Inc., Newark, CA, USA
fYear :
1992
fDate :
19-21 Feb. 1992
Firstpage :
230
Lastpage :
231
Abstract :
A cell-based array is described which is intended primarily for mixed-signal receiver-on-a-chip (ROC) applications. The array is implemented in a silicon bipolar process with peak f/sub T/ and f/sub max/ of 14 GHz and 20 GHz, respectively. The process has two-level Au metal, 2- mu m emitter-base pitch interdigitated devices, polysilicon thin-film resistors, and 2- mu m-thick field oxide for minimal wiring parasitics. The basic RF and digital subsystem blocks available on the array are illustrated. The 1.8*1.8 mm/sup 2/ array is intended primarily for receiver applications up to 4 GHz, but can also implement many transmit functions for systems up to 2 GHz with separate external power amplifiers. An example application for a Global Positioning System satellite receiver is shown by an architecture where most of the RF and phase-locked loop components have been integrated on the array.<>
Keywords :
MMIC; bipolar integrated circuits; cellular arrays; mixed analogue-digital integrated circuits; radio receivers; radionavigation; satellite relay systems; 1.8 mm; 2 micron; 4 GHz; Au metal; GPS receiver; Global Positioning System satellite receiver; MMIC; RF components; RF subsystem blocks; ROC; Si chip; bipolar IC; cell-based array; digital subsystem blocks; f/sub T/; f/sub max/; field oxide; interdigitated devices; minimal wiring parasitics; mixed-signal cellular array; parameterized-cell array; phase-locked loop components; polysilicon thin-film resistors; receiver applications; receiver-on-a-chip; transmit functions; two level metallisation; wireless applications; Global Positioning System; Gold; Phased arrays; Power amplifiers; Radio frequency; Radiofrequency amplifiers; Resistors; Silicon; Thin film devices; Wiring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference, 1992. Digest of Technical Papers. 39th ISSCC, 1992 IEEE International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-0573-6
Type :
conf
DOI :
10.1109/ISSCC.1992.200496
Filename :
200496
Link To Document :
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