Title :
Spherical silicon 1 mm device and its clustering
Author_Institution :
Ball Semicond. Inc., Allen, TX, USA
Abstract :
Instead of using conventional flat and rectangular chip technology, the paper proposes fabrication of semiconductor devices and sensors on 1 mm-diameter spherical silicon (Ball) substrates. This paper describes five key enabling process technologies to realize Ball products such as integrated circuits and 3-axis accelerometers, including a clustering technology to connect Ball devices together like the atoms of a molecule
Keywords :
accelerometers; electric sensing devices; elemental semiconductors; integrated circuit technology; semiconductor technology; silicon; 1 mm; Ball device interconnection; Ball products; Si; clustering technology; enabling process technologies; flat rectangular chip technology; integrated circuits; semiconductor device fabrication; semiconductor devices; semiconductor sensors; spherical silicon Ball substrates; spherical silicon device; spherical silicon device clustering; three-axis accelerometers; Chemical technology; Crystallization; Fabrication; Integrated circuit technology; Lapping; Plasma materials processing; Plasma temperature; Semiconductor device manufacture; Shape; Silicon;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-930815-64-5
DOI :
10.1109/ISAOM.2001.916554
