• DocumentCode
    3040033
  • Title

    The design and properties of new, Pb-free solder alloys

  • Author

    McCormick, Matt ; Jin, S.

  • Author_Institution
    AT&T Bell Labs., Murray Hill, NJ, USA
  • fYear
    1994
  • fDate
    12-14 Sep 1994
  • Firstpage
    7
  • Abstract
    Environmental and health concerns about the toxicity of Pb in solders have prompted a great deal of research to find suitable Pb-free replacement alloys. The goal of the research presented in this paper is to identify Pb-free alloys as close in melting temperature to the near-eutectic 40 Pb-60 Sn solder (melting point of 183°C) that possess the best combination of mechanical properties. Enhanced mechanical properties are achieved through metallurgical manipulation of alloy microstructures. Three alloys are presented with superior mechanical properties: i) Sn-3.5 Ag-1 Zn with a melting point of ~217°C, ii) Sn-3.5Ag-1 Zn-0.5 Cu with a melting point of ~226°C, and iii) Sn-8Zn-5In-(O.1-0.5)Ag with a melting point of ~187°C
  • Keywords
    copper alloys; indium alloys; mechanical properties; melting point; silver alloys; soldering; tin alloys; zinc alloys; 187 to 217 C; Pb-free solder alloys; SnAgZn; SnZnAgCu; SnZnInAg; mechanical properties; melting point; Costs; Electronics packaging; Lead; Manufacturing; Material properties; Mechanical factors; Microstructure; Soldering; Temperature dependence; Water pollution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Manufacturing Technology Symposium, 1994. Low-Cost Manufacturing Technologies for Tomorrow's Global Economy. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International
  • Conference_Location
    La Jolla, CA
  • Print_ISBN
    0-7803-2037-9
  • Type

    conf

  • DOI
    10.1109/IEMT.1994.404698
  • Filename
    404698