Integrated “turn-key” flip chip capability in assembly subcontracting

Large captive companies have successfully run flip chip programs for years, but expansion of the merchant flip chip market has been limited in large part by the maturity of the sub-contractor infrastructure. This is changing rapidly due to the emergence of several merchant flip chip suppliers that are now running manufacturing volumes. Arguably, the success of these programs will be dependent on their ability to integrate bumping and assembly to produce high yielding/quality products in minimum cycle times. This paper reviews the integrated flip chip capability at Amkor Technology, the paste and electroplated bumping processes in use, and resulting reliability performance of three key FCBGA packages. Wafer bumping and substrate design rules are also discussed as they present opportunities for package cost reduction