Integrated “turn-key” flip chip capability in assembly subcontracting

Author

Kim, P.G. ; Berry, C.J. ; Mescher, P. ; Thompson, L. ; Groover, R.

Author_Institution

Amkor Technol., Chandler, AZ, USA

fYear

2001

fDate

2001

Firstpage

180

Lastpage

185

Abstract

Large captive companies have successfully run flip chip programs for years, but expansion of the merchant flip chip market has been limited in large part by the maturity of the sub-contractor infrastructure. This is changing rapidly due to the emergence of several merchant flip chip suppliers that are now running manufacturing volumes. Arguably, the success of these programs will be dependent on their ability to integrate bumping and assembly to produce high yielding/quality products in minimum cycle times. This paper reviews the integrated flip chip capability at Amkor Technology, the paste and electroplated bumping processes in use, and resulting reliability performance of three key FCBGA packages. Wafer bumping and substrate design rules are also discussed as they present opportunities for package cost reduction

Keywords

ball grid arrays; electroplating; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; microassembling; outsourcing; FCBGA packages; assembly subcontracting; bumping/assembly integration; electroplated bumping process; flip chip; flip chip programs; integrated flip chip capability; integrated turn-key flip chip capability; manufacturing volumes; merchant flip chip market; merchant flip chip suppliers; package cost reduction; paste bumping process; product quality; product yield; reliability performance; sub-contractor infrastructure; substrate design rules; wafer bumping; Assembly; Flip chip; Lead; Packaging; Production facilities; Sputter etching; Subcontracting; Testing; Wafer bonding; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on

Conference_Location

Braselton, GA

Print_ISBN

0-930815-64-5

Type

conf

DOI

10.1109/ISAOM.2001.916572

Filename

916572