• DocumentCode
    3040173
  • Title

    Let´s revise the ASTM method F.459 for wirebonding process control

  • Author

    Van Pham, Cuong ; Huth, Ken

  • fYear
    2001
  • fDate
    2001
  • Firstpage
    186
  • Lastpage
    194
  • Abstract
    Wire pull testing cannot be used to monitor wirebonding process control as the X-bar and R charts of row pull strength data routinely demonstrate wide variations. The bonding process appears to be out-of-control; indeed, the testing methodology and data collection itself are inaccurate in representing the process. Many factors, which are difficult to control in production, can subtly affect the raw SPC data. This paper reviews the pull test method used to identify the potential variation(s) that causes the errors and are misleading in the process control. The paper also includes the efforts to revise the ASTM´s method F.459 for its pull test in making the data collected using this method applicable in the statistic process control (SPC) chart
  • Keywords
    adhesion; error analysis; integrated circuit interconnections; integrated circuit packaging; lead bonding; mechanical testing; standards; statistical process control; ASTM method F.459; SPC chart; bonding process; data collection; process representation; process variation; production control; pull test method; raw SPC data; row pull strength data charts; statistic process control chart; testing methodology; wire pull testing; wirebonding process control; wirebonding process monitoring; Bonding forces; Bonding processes; Differential equations; Hydrogen; Monitoring; Process control; Production; Scanning probe microscopy; Testing; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on
  • Conference_Location
    Braselton, GA
  • Print_ISBN
    0-930815-64-5
  • Type

    conf

  • DOI
    10.1109/ISAOM.2001.916573
  • Filename
    916573