Title :
Study of curing mechanism of epoxy/phenolic system for underfill applications
Author :
Zhang, Zhuqing ; Wong, C.P.
Author_Institution :
Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
Underfill technology has been adopted for high reliability in flip-chip on organic board. The epoxy/phenolic resin system is a potential candidate underfill. The curing mechanism of the epoxy/phenolic system is studied using the differential scanning calorimeter and temperature controlled Fourier transform infrared spectrometer. The effect of hardener and catalyst type and the catalyst concentration on the curing mechanism is investigated. It is found that 1,8-diazabicyclo[5.4.0]undec-7-ene has the tendency to catalyze condensation reaction within hydroxyl groups at high temperature during curing. It can be a potential concern in no-flow underfill applications when the resin undergoes high temperature reflow
Keywords :
Fourier transform spectra; catalysis; chip-on-board packaging; condensation; differential scanning calorimetry; encapsulation; flip-chip devices; heat treatment; integrated circuit reliability; polymer blends; reflow soldering; 1,8-diazabicyclo[5.4.0]undec-7-ene; catalyst concentration; catalyst type; condensation reaction catalysis; curing; curing mechanism; differential scanning calorimeter; epoxy/phenolic resin system; epoxy/phenolic system; flip-chip on organic board; hardener; hydroxyl groups; no-flow underfill applications; reliability; resin high temperature reflow; temperature controlled Fourier transform infrared spectrometer; underfill; underfill applications; underfill technology; Chemicals; Control systems; Curing; Fourier transforms; Infrared spectra; Materials science and technology; Packaging; Resins; Spectroscopy; Temperature control;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-930815-64-5
DOI :
10.1109/ISAOM.2001.916585
