Study of curing mechanism of epoxy/phenolic system for underfill applications

Author

Zhang, Zhuqing ; Wong, C.P.

Author_Institution

Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2001

fDate

2001

Firstpage

257

Lastpage

260

Abstract

Underfill technology has been adopted for high reliability in flip-chip on organic board. The epoxy/phenolic resin system is a potential candidate underfill. The curing mechanism of the epoxy/phenolic system is studied using the differential scanning calorimeter and temperature controlled Fourier transform infrared spectrometer. The effect of hardener and catalyst type and the catalyst concentration on the curing mechanism is investigated. It is found that 1,8-diazabicyclo[5.4.0]undec-7-ene has the tendency to catalyze condensation reaction within hydroxyl groups at high temperature during curing. It can be a potential concern in no-flow underfill applications when the resin undergoes high temperature reflow

Keywords

Fourier transform spectra; catalysis; chip-on-board packaging; condensation; differential scanning calorimetry; encapsulation; flip-chip devices; heat treatment; integrated circuit reliability; polymer blends; reflow soldering; 1,8-diazabicyclo[5.4.0]undec-7-ene; catalyst concentration; catalyst type; condensation reaction catalysis; curing; curing mechanism; differential scanning calorimeter; epoxy/phenolic resin system; epoxy/phenolic system; flip-chip on organic board; hardener; hydroxyl groups; no-flow underfill applications; reliability; resin high temperature reflow; temperature controlled Fourier transform infrared spectrometer; underfill; underfill applications; underfill technology; Chemicals; Control systems; Curing; Fourier transforms; Infrared spectra; Materials science and technology; Packaging; Resins; Spectroscopy; Temperature control;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on

Conference_Location

Braselton, GA

Print_ISBN

0-930815-64-5

Type

conf

DOI

10.1109/ISAOM.2001.916585

Filename

916585